PMTC Solder Ball – Low Alpha
|
|
Normal Lead (Pb) |
10~100 CPH/cm2 |
Low Alpha (Pb) |
10~100 CPH/cm2 |
Ultra-Low Alpha (Pb) |
less than 0.1 CPH/cm2 |
|
ULA Grade |
SULA Grade |
|
Spec. |
Spec. |
Pb-Sn |
≦0.1 CPH/cm2 |
≦0.005 CPH/cm2 |
Spec of Solder Ball
Diameter
(mm) |
Diameter Tolerance(±mm) |
Cpk of Diameter |
Spheroid Tolerance(%) |
0.760
0.650 |
0.015 |
≧1.33 |
Within 1.5 |
0.600
0.500
0.450
0.400
0.350
0.300
0.250
0.200 |
0.010 |
0.150
0.100
0.075 |
0.005 |
＊ Sizes and allowances of soder balls may be adjusted as requested.
＊ Cpk for solder ball diameter analysis is≧ 1.33 |
Standard Package
The following is a standard shipping packaging, if customer has specific needs, the shipping packaging can change according to customer specification.
Diameters |
Qty/Bottle |
Qty/Carton |
Carton Dimension |
0.76mm(30 mils) |
500kpcs |
5kk pcs |
395(W)X275(L)X 105(H) mm |
0.65mm(25 mils) |
500kpcs |
0.60mm(24 mils) |
1,000kpcs |
10kk pcs |
0.50mm(20 mils) |
1,000kpcs |
0.45mm(18 mils) |
2,000kpcs |
20kk pcs |
0.40mm(16 mils) |
2,000kpcs |
0.35mm(14 mils) |
2,000kpcs |
40kk pcs |
0.30mm(12 mils) |
2,000kpcs |
0.25mm(10 mils) |
2,000kpcs |
70kk pcs |
0.20mm( 8 mils) |
2,000kpcs |
0.15mm( 6 mils) |
2,000kpcs |
0.10mm( 4 mils) |
2,000kpcs |
0.075mm(3 mils) |
2,000kpcs |
＊ The specification of packing is also available on your request.
-
Use the anti-static material for packaging.
-
The color and type of bottles are available upon customer request.
-
ESD bottles characteristics
Desiccant had been designed in the ESD bottles.
Marking on bottle
Customer part no. (If request)
Product name & alloy composition
Solder ball diameter
Quantity per bottle
Lot No.
Manufacturing date
Validity period
Company name
Product name
Size
Composition
Quantity
Customer part no. (If request)
Net Weight
Gross Weight
The validity period of these products shall be one year upon manufacturing date.
Storage Method
-
The guarantee of shelf life for solder ball is 1 year (12 months) when solder balls are stored under unopened bottles and pointed storage condition as following.
-
Temperature : 25 ±10 ℃
-
Humidity : < 65 %RH
-
The condition of temperature and humidity in process is better same with storage condition.
-
To avoid the solder ball to be damaged by shake, moisture and light in store area.
-
Suggestion that the solder ball should be kept in the ESD bottle when the ball not be used up, and lock the lid of bottle.
-
To prevent the oxidation of solder ball, the solder ball should be used ASAP after opening.
|
