※Mark 1：This series of tin-silver-copper products, have added trace composition of Ni, Ge, and obtained lead-free patent authorization by Japan's Fuji Electric.
※The solder alloy compositions are available on your request.
※The doping of impurity elements are available on your request.
※This product is declared to comply with RoHS requirements.
＊Patent No.
Lead-Free Patent Authorized by Fuji Electric Systems. |
Spec of Solder Ball
Diameter
(mm) |
Diameter Tolerance(±mm) |
Cpk of Diameter |
Spheroid Tolerance(%) |
0.760
0.650 |
0.015 |
≧1.33 |
Within 1.5 |
0.600
0.500
0.450
0.400
0.350
0.300
0.250
0.200 |
0.010 |
0.150
0.100
0.075 |
0.005 |
＊ Sizes and allowances of soder balls may be adjusted as requested.
＊ Cpk for solder ball diameter analysis is≧ 1.33 |
Standard Package
The following is a standard shipping packaging, if customer has specific needs, the shipping packaging can change according to customer specification.
Diameters |
Qty/Bottle |
Qty/Carton |
Carton Dimension |
0.76mm(30 mils) |
500kpcs |
5kk pcs |
395(W)X275(L)X 105(H) mm |
0.65mm(25 mils) |
500kpcs |
0.60mm(24 mils) |
1,000kpcs |
10kk pcs |
0.50mm(20 mils) |
1,000kpcs |
0.45mm(18 mils) |
2,000kpcs |
20kk pcs |
0.40mm(16 mils) |
2,000kpcs |
0.35mm(14 mils) |
2,000kpcs |
40kk pcs |
0.30mm(12 mils) |
2,000kpcs |
0.25mm(10 mils) |
2,000kpcs |
70kk pcs |
0.20mm( 8 mils) |
2,000kpcs |
0.15mm( 6 mils) |
2,000kpcs |
0.10mm( 4 mils) |
2,000kpcs |
0.075mm(3 mils) |
2,000kpcs |
-
•Use the anti-static material for packaging.
-
•The color and type of bottles are available upon customer request.
-
•ESD bottles characteristics
-
Desiccant had been designed in the ESD bottles.
•Marking
Marking on bottle
Customer part no. (If request)
Product name & alloy composition
Solder ball diameter
Quantity per bottle
Lot No.
Manufacturing date
Validity period
Company name
Product name
Size
Composition
Quantity
Customer part no. (If request)
Net Weight
Gross Weight
The validity period of these products shall be one year upon manufacturing date.
Storage Method
-
•The guarantee of shelf life for solder ball is 1 year (12 months) when solder balls are stored under unopened bottles and pointed storage condition as following.
-
•Temperature : 25 ±10 ℃
-
•Humidity : < 65 %RH
-
•The condition of temperature and humidity in process is better same with storage condition.
-
To avoid the solder ball to be damaged by shake, moisture and light in store area.
-
•Suggestion that the solder ball should be kept in the ESD bottle when the ball not be used up, and lock the lid of bottle.
-
•To prevent the oxidation of solder ball, the solder ball should be used ASAP after opening.
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