PVA has unveiled the next generation of high speed semiconductor packaging dispense systems with the PVA850. Touting speed and accuracy capability unique to the adhesive dispensing industry, the PVA850 will provide throughput and flexibility unlike any rival. PVA’s robust gantry design can accommodate multiple dispense heads and requires no periodic positional calibration. The PVA850 is ideally suited for any underfill, glob top, dam and fill, wire bond, or die attach dispensing process where high speed, accuracy, and flexibility are of the highest demand.
The PVA850 has many integrated features including:
Robotic system accuracy of 25 microns
Active vision system with fiducial recognition and correction
Closed loop process control from gantry system to dispense

Valve
Maximum axis speed of 1750 mm/sec (68.9”/sec) and 2g
acceleration for incredibly high throughput
Micron level encoder resolution for unparalleled dispensing
accuracy
Exclusive PathView programming environment
For more information on PVA’s automated dispensing capabilities,
please contact one of our sales representatives at (518) 371-2684.
PVA850 SPECIFICATIONS
Gantry System Design:
Closed loop brushless DC servo motors, ball
screw slide, and optical encoders on all axes

XYZ Travel:
500 mm x 500 mm x 100 mm
(19.68 in x 19.68 in x 3.94 in)
Single Valve Dispense Area:
330 mm x 350 mm
(12.99 in x 13.78 in)
Dual Valve Dispense Area:
300 mm x 350 mm
(11.81 in x 13.78 in)
Footprint:
1219 mm x 1350 mm x 1577 mm
(48” x 53.15” x 62.09”)
Weight:
509 kg (1122.15 pounds)
Air Supply:
10 cfm at > 80 psi (5.5 bar) filtered at 5 microns
Power:
208 – 240 VAC, 50 – 60 Hz
15 Solar Drive
Halfmoon NY 12065
tel 518 371 2684
fx 518 371 2688
info@pva.net

PVA850
The PVA850 is ideal for SMT dispensing applications that include edge bonding, surface mount adhesive, solder paste, and
conductive adhesives. Common semiconductor packaging processes include underfill, encapsulation, dam and fill, glob top,
thermal grease, lid seal, and die attach.
PVA850 Accuracy: 25 microns (0.001”)
Board Handling:
XYZ Placement Accuracy: 50 microns (0.002”) Conveyor Type: Flat belt or chain
Minimum Conveyor Width: 50 mm (1.97”)
Above Board Clearance: 55 mm (2.17’)
XYZ Specifications Under Board Clearance: 20 mm (0.79”)
XYZ Repeatability: 25 microns (0.001”) Transport Height: 940 mm – 965 mm (37” – 38”)
Maximum Speed (XYZ): 1750 mm/sec (68.9”/sec) Communication Protocol: SMEMA
Maximum Acceleration: 2g Conveyor Options: SMT edge clamp with lift and
locate or vacuum support
Encoder Resolution (XY): 2.5 microns Heating Zones: Up to three
Encoder Resolution (Z): 1.25 microns Heated Lift Options: Contact or non-contact
convection heat transfer
Z Axis Sensing: Tactile or CCD laser Lift Temperature Range Ambient to 150°C
Standard Features: Dispensing Methods:
Active vision system with fiducial recognition / correction Dispense Valve Control: Closed loop DC servo axis
Automatic XYZ calibration SD5000: Servo controlled syringe pump
Laser height sensor SV500: Servo controlled auger valve
Tactile height sensor FC100: Front closing needle valve
Advantek industrial PC with Windows XP operating system Material Feed Options: Bulk feed cartridge (6 – 20 oz.)
Hard drive, DVD-RW, and Ethernet program storage Syringe
Light tower Pressure vessel
Optional Features:
Dual head tooling
Automatic needle cleaner
Bar code program selection
Dual lane conveyors
Conveyor auto width adjust
Low level material sensor
Valve and / or material heating
1219 mm
1016 mm
947 mm