The Ultra 850G modular AOI solution is capable of a range of electro-optic solutions including flying color, UV lighting and true color. Camera FOVs are scalable to produce a pixel size of 3-25 microns. In addition a range of flexible material handling solutions including single and dual lane are available to process pcb assemblies, JEDEC trays and metal carriers.
Configurable electro-optics solutions provide performance inspection capabilities for ：

• •C4 and SMT Integrated Inspection

• •High Accuracy Die Placement Measurement

• •Surface Finish and Scratches

• •2D Flux

• •Epoxy Spread, Pre and Post Cure

• •Wire bond

• •Glues and Sealants

• •3D Paste and BGA

• •SMT Pre and Post Reflow

• •LEDs

High Accuracy C4 Assembly Inspection

• •In line high speed positional accuracy of C4 die placement (X, Y and Rotation) Post and Pre Reflow

• •Die damage

• •Cracks, Contamination and edge quality

• •Single and multiple die

• •Hybrid C4 and SMT Component Inspection

• •Single or Dual Lane Options

• •Metal and JEDEC Carrier or Strip Material Handling

Applicable models MVP 850 XD and MVP 850 SD C4 Epoxy Underfill

• •Epoxy Boundary (Flow and spread)

• •Epoxy Fillet (Quality and defects)

• •Excess Epoxy (anywhere in the inspection area)

• •Pre and Post Epoxy Cure

• •Inline or Offline

• •Single or Dual Lane Options

• •Metal or JEDEC Carrier or Strip Material Handling

• •Applicable Models MVP 850 XE and MVP 850 SE

2D Flux Inspection without Florescent additives

• •Flux boundary and coverage (flow and spread)

• •Flux deposition positional accuracy

• •Single or Dual Lane Options

• •Metal or JEDEC Carrier or Strip Material Handling

Applicable Models MVP 850 XF and MVP 850 SF Surface Finish and Scratches

• •Surface damage such as scratch, exposed circuitry

• •Single or Dual Lane

• •Metal or JEDEC Carrier, or Strip Material Handling

Applicable Models MVP 850 XD and MVP 850 SD Wire Bond

• •Wire tracing conformity, Bent and broken wires

• •Distance to adjacent wire, Straightness Tolerance

• •Ball/Wedge Geometry

• •Contamination

• •SMT Assembly Defects

• •Single or Dual Lane

• •Metal or JEDEC Carrier, or Strip Material Handling

Applicable Models MVP 850 XD and MVP 850 SD 3D Paste

• •In line high speed inspection of paste deposition

Positional accuracy
Volume
Height

• •Single or Dual Lane

• •Metal or JEDEC Carrier, or Strip Material Handling

Applicable Models MVP 850 XP and MVP 850 SP