A cost-effective, reliable, and highly configurable product family designed to address diverse customer requirements

FOX-15 Family of Full Wafer Burn-in & Test Systems

• •Cost-effective Solution for Producing:

•  -Known-Good-Die (KGD) for MultiChip Packages

•  -Zero-defect automotive ICs

• •Production Proven Full-Wafer Burn-In Solution:

• -Protects wafers and probe cards with individual power channel overcurrent protection

• -High volume production capacity

• -15 wafers per load

• •Reduces Costs:

• -Reduces burn-in times by enabling higher burn-in temperatures

• -Reduces final test costs by functionally testing wafer during burn-in

• -Saves packaging costs by deferring until after burn-in

• -Highly reliable — 4th generation design

Brochure SignFox15.pdf