Dage 4300FP

Semi-automatic Wafer Bump Tester

The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.

•Shear testing using Nordson DAGE's patented air bearing frictionless intelligent load cell system

•Fully automatic wafer handling via customer's third party robot handler (SMIF/FOUP) equipment

•Wafer handler and bondtester can operate in isolated environment with minimum operator interaction

•Joystick manipulation of 100% of wafer surface under test head without repositioning of wafer

•Semi-automatic test routines using 2 reference points (no camera system required) per wafer enable bondtesting to the entire wafer surface without repositioning

•460mm x 300mm  XY stage with robot compatible chuck.  Pneumatically operated pins allow wafer exchange using a robot handler

•360 degree load tool rotation - optional

•Automatic calibration and linearity checks

•Integrated analysis including statistics and SPC functions

•ODBC compliant