The Dage Group

Dage x-ray systems have been specifically and ergonomically designed for the critical and demanding test and inspection requirements of the printed circuit board (PCB) and semiconductor industries. The superior x-ray image quality and automated inspection that Dage provides as standard is achieved through the easiest to use operator interface in the industry. X-ray tube resolution can be provided at the microfocus or sub-micron ('nano-focus') levels. All together, these capabilities are used for non-destructive, real time failure analysis and process quality control, especially for tin/lead and lead-free components that have optically hidden solder joints, such as Ball Grid Arrays (BGAs), flip chips and other chip scale packages.
	XD7600 XiDAT Digital X-ray Sub-Micron - The XiDAT digital advantage (XiDAT - X-ray integrated Digital Acquisition Technology) - 70° oblique angle views - Sub-micron resolution and active x-ray image stabilisation (AXIS)	XD7100 XiDAT Digital X-ray Sub-Micron - The XiDAT digital advantage for larger boards - Maximum board size 26" x 20" (660 x 520 mm) - Maximum sample weight 8 kg
	XD7500 XiDAT Digital X-ray Micro-Focus - Real-time digital X-ray inspection with XiDAT -16-bit image processing with live images at 25fps - Enhanced resolution X-ray images – 1.3M pixels	XD7000 Large Format Digital X-ray Micro-Focus - Maximum board size 26" x 20" (660 x 520 mm) - Maximum sample weight 8 kg The easiest to use X-ray system in the industry

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