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IC Scanner LI-2000
IC Scanner LI-2000
Achieve higher through-put, and reduce transfer time by inspecting more packages simultaneously.
2&3 dimensional inspection in high accuracy.
Inspect on the both side of package on any item.
Improve quality control by output of abundant statistic data.
 

Standard specifications

Applicable packages

Type : CSP,BGA
Ball diameter : ƒÓ0.1mm or more
Qty of ball : Max 3600 (60ball x 60ball)

Application tray

Type : JEDEC,EIAJ
Matrix : Max 20 x 50

Processing capacity

CSP 6x6 (1tray 16 x 40IC) : 15000UPH

External dimension

1940(W) x 1300(D) x 1542(H)

Items to measure

Coplanarity, Stand-off, Package Warpage, Total height, Overall length,width, Deviation of Center position, Ball height, Ball diameter, No ball,
Exterior inspection(Upper side) : Mark, Void, Direction, Chip crack
Exterior inspection(Lower side) : Defective Resin, Defective Tape, Contamination

Option

Unloader Tape

   
IC Scanner LI-700
Features

Equipment to inspect the appearance before delivery of tray-conveying type IC such as QFP and TSOP and PLCC.

Standard specifications

Applicable packages

QFP, SOP, PLCC and SOJ
7 x 7 to 40 x 40mm

Conveyor

Tray

Processing capacity

QFP 208Pin : 2700UPH
TSOP 50Pin : 3200UPH

External dimension

1860 x 1140 x 1620

Items to measure

Flatness and Bend of Lead, Standoff, Overall height, Overall length, Overall width, Uneven edge length, Package warp, etc.

Option

Stamp and void test, Accommodation of unloader stick, Inspection of foreign matters between leads, Lead adjuster

 


 

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