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Electronics Products
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Medical Products
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About Us |
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¡@Electronics Products |
| ¡@.Reliability Test for Semiconductor, ¡@LED, PCB & SMT |
| ¡@.Scientific |
| ¡@.Technical Service Department |
| ¡@.Contact Us |
| High Accuracy Wafer level Solder Ball Mounting machin: |  |
| ¡CIn-line
type Solder Ball Mounting machine suitable for mass production ¡@applications. ¡CHigh accuracy ball mounting by vision system alignment. ¡CHigh productivity is achieved by the integration of independent flux ¡@transfer, ball mounting and inspection systems into a single unit using ¡@an index transfer system. ¡CThe vision system and the transfer unit are integrated into a single ¡@space-saving module. ¡CThe system uses flexible pin transfer to prevent substrate warping. ¡CFloating ball supply system with suction ball pick-up prevents ball ¡@damage. ¡CBall mounting error detection is a standard feature. |
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Model
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SBM361
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Solder
ball size
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0.2
- 1.0mm diameter
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Ball
mounting area
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Max.70
x 230mm
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BGA
substrate size
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25
- 110(W) x 100 - 270(L)mm
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Cycle
time
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8
- 9sec./Cycle
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Ball
mounting accuracy
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+/-
0.05mm
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Dimensions
(Only for SBM351)
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1250(L)
x 2100(W) x 1650(H)mm
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Net
weight (Only for SBM351)
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1900kg
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 |
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¡C
Wafer level CSP Solder Ball Mounting machine. ¡CHigh accuracy ball mounting by vision system alignment. ¡CHigh productivity is achieved by the integration of independent flux transfer, ball ¡@mounting and inspection systems into a single unit using an index transfer system. ¡CFloating ball supply system with suction ball pick-up prevents ball damage. ¡CUnique vision system inspection of ball pick-up for errors prior to mounting to ¡@minimize mounting error rejects. |
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Model
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SBM361
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Solder
ball size
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0.2 - 1.0mm diameter
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Ball
mounting area
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Max.8 inch
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BGA
substrate size
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Max.8 inch diameter
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Cycle
time
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90sec./Cycle(0.3mm diameter ball above)
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Ball
mounting accuracy
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+/- 0.05(3 sigma)mm
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Dimensions
(Only for SBM351)
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1200(L) x 1800(W) x 1825(H)mm
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Net
weight (Only for SBM351)
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2000kg
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| ¡@ELECTRONICS BUSINESS |