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Spec of Solder Sphere

1. Standard Solder Sphere
The solder alloy compositions are available on your request.

TIN LEAD TYPE

TIN LEAD TYPE	Tin (Sn)	Silver (Ag)	Copper (Cu)	Melting Point ( ℃ )
TIN LEAD TYPE	Tin (Sn)	Silver (Ag)	Copper (Cu)	Eutectic	Solidus	Liquidus
SnA3	10	90	--	--	275	302
SnB1	62	36	2	179	--	--
SnA1	63	37	--	183	--	--

　* Solder ball composition follow the JIS Z3282 specification

LEAD-FREE TYPE

LEAD-FREE TYPE	Tin (Sn)	Silver (Ag)	Copper (Cu)	Melting Point ( ℃ )
LEAD-FREE TYPE	Tin (Sn)	Silver (Ag)	Copper (Cu)	Eutectic	Solidus	Liquidus
* SnC1	96.5	3.5	--	221	--	--
SnD7	98.5	1.0	0.5	--	220	225
SnD3	96.5	3.0	0.5	--	217	219
SnD5	95.5	3.8	0.7	--	217	219
SnD1	95.5	4.0	0.5	--	217	219

* Patent Free

Lead-Free Patent No.

Countries	Patent No
Japan	JP 3,296,289
Japan	JP 3,353,662
American	USP 6,179,935B1
Germany	DE 19,816,671C2

2. Low Alpha Solder Sphere

Below is the alpha grade in lead products based on CPH (counts per hour).

Type	Activity
Normal Lead (Pb)	10~100 CPH/cm²
Low Alpha (Pb)	less than 1.0 CPH/cm²
Ultra-Low Alpha (Pb)	less than 0.1 CPH/cm²

Product Spec

	ULA Grade	SULA Grade
	Spec.	Spec.
Pb-Sn	≦0.1 CPH/cm²	≦0.005 CPH/cm²

3. Electro-Plating BGA Solder Sphere

Electro-Plating Thickness	20~50 microns
Plating Layer	Pure tin, Sn-Ag Alloy
Core Ball	Solder alloy upon request

Diameters Tolerance & Spheroid Tolerance

Diameters	Diameters Tolerance	Spheroid Tolerance
0.76 mm	±0.015 mm	Within 1.5%
0.65 mm	±0.015 mm	Within 1.5%
0.60 mm	±0.010 mm	Within 1.5%
0.50 mm	±0.010 mm	Within 1.5%
0.45 mm	±0.010 mm	Within 1.5%
0.40 mm	±0.010 mm	Within 1.5%
0.35 mm	±0.010 mm	Within 1.5%
0.30 mm	±0.010 mm	Within 1.5%
0.25 mm	±0.010 mm	Within 1.5%
0.20 mm	±0.010 mm	Within 1.5%
0.15 mm	±0.005 mm	Within 1.5%
0.10 mm	±0.005 mm	Within 1.5%

Note: The diameters of tolerance are available on your request.

Available Packing

Diameters	Qty / Bottle	Bottle / Case	Case / Carton	Qty / Carton
0.76 mm	250kpcs	6	10	15 kk pcs
0.65 mm	250kpcs	6	10	15 kk pcs
0.60 mm	250kpcs	6	10	15 kk pcs
0.50 mm	500kpcs	6	10	30 kk pcs
0.45 mm	1,000kpcs	6	10	60 kk pcs
0.40 mm	1,000kpcs	6	10	60 kk pcs
0.35 mm	1,000kpcs	6	10	60 kk pcs
0.30 mm	1,000kpcs	10	10	100 kk pcs
0.25 mm	1,000kpcs	10	10	100 kk pcs
0.20 mm	1,000kpcs	10	10	100 kk pcs
0.15 mm	1,000kpcs	10	10	100 kk pcs
0.10 mm	1,000kpcs	10	10	100 kk pcs

Solder spheres are packaged in ESD containers with a desiccant and fill in inert Nitrogen.

Storage and Handling

Clean and dry environments are required for solder spheres storage. Probing of solder spheres in containers with fingers or other implements can damage the solder spheres by changing its shape, scoring its surface or contaminating its surface by skin oils. Shelf life of all solder spheres, stored in sealed ESD containers that are not agitated, is 1 year (12months).

Products are stored in environment below

Temperature : 25 +/- 5 ℃ Humidity : 60 +/- 20 %RH

Reflow Profile

Recommend reflow profile is as below. In order to optimize the process for your specific application, experimentation is recommended.

TIN LEAD TYPE	Tin Lead Assemble
Average Ramp Up Rate	3 ℃/second max
Preheat Temperature	100℃~ 150℃
Preheat Time	60~120 Seconds
Peak Temperature	220℃~ 225℃
Time within 5 ℃ of actual Peak temperature	10~30 Seconds
Ramp Down Rate	6 ℃/second max.
Time 25 ℃ to Peak Temperature	6 minutes max

LEAD-FREE TYPE	Lead-Free Assemble
Average Ramp Up Rate	3 ℃/second max
Preheat Temperature	150℃~200℃
Preheat Time	60~180 Seconds
Peak Temperature	245℃~260℃
Time within 5 ℃ of actual Peak temperature	20~40 Seconds
Ramp Down Rate	6 ℃/second max.
Time 25 ℃ to Peak Temperature	8 minutes max