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¡@Electronics Products |
| ¡@.Reliability Test for Semiconductor, ¡@LED, PCB & SMT |
| ¡@.Scientific |
| ¡@.Technical Service Department |
| ¡@.Contact Us |
| BONDTESTERS |  |
| SERIES-5000 | |
| ULTRA FINE PITCH BONDTESTER | |
| Unrivalled Levels Of Bondtesting - Down to 25 Microns | |
At pitches of less than 35 micron, a new generation of bondtester is required. The DAGE-SERIES-5000 has been specifically designed to meet this challenge by addressing such issues as: ¡CLower range measurement. ¡CNew loadtool designs optimised to the changing shape of UFP bonds ¡@and to overcome problems associated with passivation thickness. ¡CImproved optics and illumination for easy alignment of loadtools to ¡@bonds and grading of failure modes. ¡CImproved shear height accuracy and repeatability. ¡C Anti-vibration measures to maintain accuracy and optical performance ¡@within typical environmental conditions. ¡CImproved control over sample manipulation under the test head. |
| KEY FEATURES |
| ¡CEasily adjustable optics mounting |
| ¡CLow force/high resolution loadcartridges |
| ¡C'Quick Guard' loadtools |
| ¡CBorescope image system |
| ¡CHigh precision X,Y sample manipulation |
| ¡CAnti-vibration mount |
| ¡CCavity Shear |
| ¡@ELECTRONICS BUSINESS |