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ULVAC Wafer Bump Inspection system:
IS-300 / IS-3300
Wafer Bump Inspection system 3D inspection machine using a scanned laser. Heights of bumps of solder, Au, etc., are inspected quickly with high precision, and 2D inspection can be conducted simultaneously.


Feature
Inspection machine by scanned laser with AOD (Acousto-Optical-Deflector), which solved a mechanical vibration problem.
Simultaneous 3D/2D inspection.
Automatic adjustment function for optical system: Making measurement conditions uniform.
Simple recipe setting and operation: Chip data, wafer data and alignment data.
Multifaceted result display: Monitoring state of inspection and real-time display of results of each chip.

Specifications
Model
IS-300
IS-3300
Wafer size
150mm and 200mm
200mm and 300mm
Wafer thickness
300£gm - 1000£gm
Chip size
0.5mm x 0.5mm - 30mm x 30mm
Bump height
10£gm -100£gm, 20£gm - 200£gm, and 40£gm - 400£gm


 


 

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