

|
Electronics Products
|
Medical Products
|
About Us |
|
”@Electronics Products |
| ”@.Reliability Test for Semiconductor, ”@LED, PCB & SMT |
| ”@.Scientific |
| ”@.Technical Service Department |
| ”@.Contact Us |

| ULVAC Wafer Bump Inspection system: | ![]() |
| IS-300 / IS-3300 | |
| Wafer
Bump Inspection system 3D inspection machine using a scanned laser.
Heights of bumps of solder, Au, etc., are inspected quickly with high
precision, and 2D inspection can be conducted simultaneously. |
|
|
|
| Model |
IS-300
|
IS-3300
|
| Wafer size |
150mm and 200mm
|
200mm and 300mm
|
| Wafer thickness |
300£gm - 1000£gm
|
|
| Chip size |
0.5mm x 0.5mm - 30mm x 30mm
|
|
| Bump height |
10£gm -100£gm, 20£gm - 200£gm, and 40£gm - 400£gm
|
|
| ”@ELECTRONICS BUSINESS |