NSX 330 Series
The NSX® family is the market leader for automated macro defect inspection for advanced packaging. Built on that success, the NSX 330 Series enables advanced packaging processes by directly improving the cost of ownership of multiple applications in a single platform. With a combination of inspection plus metrology approach, NSX 330 Series measures multiple applications including 100% wafer level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load. 

The NSX 330 Series builds on the advancements in platform technology offered by the NSX 320 System: high-acceleration staging, high-speed multi-processor computing and highly flexible software with an unprecedented level of usability. To this field-proven product, the NSX 330 Series adds increased 2D inspection and metrology throughput and a broad portfolio of 3D sensors supporting the following critical applications:

  • 100% bump height metrology
  • Simultaneous high accuracy topography, depth and thickness measurements
  • Substrate thickness, TTV, and bonded wafer thickness stack thickness (carrier, adhesive, product wafer and total stack)
  • Via depth (unlimited aspect ratio)
  • Thick and thin RST
  • Bow and warp

 

Designed for Advanced Packaging:

  • Combination inspection and metrology
  • 40% faster inspection scans
  • CD and overlay metrology in IR and visible
  • Warped and bonded wafers apps (FOWLP, FSI \ BSI image sensor, and 3D memory)
  • Simultaneous topography and thickness measurements down to 1nm resolution
  • Laser triangulation-based 100% bump height and coplanarity at 0.05µm

Specifications

  • Choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 300mm whole wafers
  • The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution. The turret assembly has five (6) available slots and includes any three (3) of 1X, 2X, 3X, 5X, 10X and 20X objectives. Other slots may be populated with purchasable additional objectives.
  • The 2D defect and metrology verification standard is designed to verify system functionality and repeatability
  • Programmable light tower
  • Standard docking module
  • Five minute recipe creation
  • Resolution flexibility (10µm to 0.5µm)
  • Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer
  • Teams with edge and backside modules for all-surface solution
  • Unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm)
  • Tool matching
  • Recipe sharing
  • Recipe server
  • Discover® Software database results archiving
  • Offline inspection and metrology engineering clients
  • Offline defect review clients