XYZTEC

Condor Sigma W12 (300mm wafer)

• Especially for 8" and 12" Wafer bumping of Fully Automation ball shear tester
• Electronic control clamp system of CBP test, Minimum size is 50um of solder bump
• Grading run with camera
• XY coordinates from Mapping key in function
• Solder residue clean system
• Tips cavity non-contact clean system after CBP test
• Integrate to Auto Wafer Loader & Unloader
• Mapping loading with Automation
• Wire pull
• Youtube sigma videos
• Youku sigma videos